A pEek on the lab

INESC MN has full access to a Class 100/10 Cleanroom for micro and nano-fabrication, operating since 1992. Device patterning is done with direct write optical lithography (min 1um), e-beam (30nm) and UV lithography (3um). The deposition and etching tools allow wafer deposition and processing on up to 25 wafers/batch, with wafer sizes up to 200mm diameter. A large variety of thin film deposition is available, including sputtering, PECVD, ion beam, electroplating, while etching includes dry etch (RIE and Ion beam milling) and wet etch. In particular, magnetic and tunnel oxide barriers are available for production in 200mm wafers. Facilities for the fabrication of microfluidics include soft-lithography, micro-milling and 3D printing.

INESC MN has laboratories for characterization of materials, devices and systems. Device encapsulation and chip mounting is available, together with electronic integration. Magnetic characterization (VSM, 4 setups for electromagnetic device characterization), SEM and X-rays, and several scanners for sensor characterization.

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