A pEek on the lab

The CPI cleanrooms area is up to 1400 m2 including Class 1000 and Class 100 sections. In Class 1000 area, tools can handle up to 12”-square substrates and the tools set is designed to demonstrate and carry out initial scale-up of processes at Low Technology Readiness Level (TRL). The scale-up phase (as an increase number of larger substrates) is carried out in Class 100, a range of large substrate (up to 370 x 470 mm) tools is hosted here including large area ALD, sputtering, plasma etching, photolithography patterning, printing and coating to process batches of rigid and flexible substrates.

CPI Beneq TFS500 ALD tool featuring the glovebox for processing samples in inert atmosphere - either Argon (Ar) or Nitrogen (N2) gas - at temperature between 50 and 400 degC depending on selected reactor. The system reactors allow to process wafer up to 12”-diameter, 370 x 470 mm single glass sheet, ten 8”-square 2 mm-thick substrates as well as 3D objects. The tool features a high temperature hot liquid/solid source and 20 degC high vapour pressure sources. A remote plasma is available for the 12”-diameter wafer processing. Ammonia (NH3) is available as reactive gas; either N2 or Ar is used as process gas.